MEMS & Sensors
From inertial measurement to acoustic sensing and biomedical diagnostics — engineered substrates and process services for the entire MEMS device ecosystem.
Overview
Micro-Electro-Mechanical Systems (MEMS) represent one of the most dynamic and commercially significant segments of the semiconductor industry — with over 15 billion MEMS sensors shipped annually into smartphones, vehicles, medical devices, industrial equipment, and aerospace platforms. The MEMS market is projected to exceed $22 billion by 2028, driven by the proliferation of IoT edge devices, autonomous vehicle sensor suites, and wearable health monitors.
GINECHIP supports MEMS foundries, fabless sensor companies, and research institutions with a comprehensive portfolio of MEMS-optimized substrates and microfabrication process services. From SOI wafers for inertial sensors to piezoelectric-deposited substrates for BAW filters, to glass wafers for anodic bonding — we deliver the materials foundation and process capability your MEMS devices demand.
MEMS Sensor Types We Support
Inertial Sensors (Accelerometers & Gyroscopes)
MEMS inertial sensors measure acceleration and angular velocity through displacement of a suspended proof mass. They form the core of automotive airbag systems, electronic stability control (ESC), smartphone orientation sensing, drone stabilization, and industrial vibration monitoring. Silicon and SOI wafers are the dominant substrates — SOI providing superior isolation and reduced parasitic capacitance for high-sensitivity capacitive readout.
Pressure Sensors
MEMS pressure sensors convert mechanical diaphragm deflection into an electrical signal via piezoresistive or capacitive transduction. Applications span automotive manifold absolute pressure (MAP), tire pressure monitoring (TPMS), medical blood pressure and intracranial monitoring, industrial process control, and altitude sensing in consumer drones.
MEMS Microphones
Capacitive micro-electromechanical microphones dominate the global acoustic sensor market — found in every smartphone, laptop, smart speaker, and hearing aid. A thin perforated backplate and flexible silicon membrane form a variable capacitor, converting acoustic pressure waves into electrical signals with high SNR and wide dynamic range.
MEMS Oscillators & Resonators
Silicon-based timing devices that replace traditional quartz crystals with MEMS resonators. Offer superior shock resistance, smaller footprint, and CMOS integration compatibility. Applications in IoT clocks, automotive CAN bus timing, and precision frequency references for communication systems.
Gas & Environmental Sensors
MEMS-based chemical sensors for detecting gases (CO₂, CO, NOx, VOCs), humidity, and particulate matter (PM2.5/PM10). Leverage heated metal-oxide sensing films, thermal conductivity measurement, or optical absorption on miniaturized platforms. Critical for air quality monitoring, industrial safety, and automotive cabin air management.
Bio-MEMS & Microfluidics
Microfabricated devices for biomedical applications: DNA microarrays, lab-on-chip diagnostic platforms, implantable drug delivery systems, neural probes, and cell sorting chips. Require biocompatible materials (SiO₂, Si₃N₄, parylene, PDMS, SU-8) and specialized surface functionalization for biomolecule immobilization.
MEMS Substrate Selection Guide
Silicon (Si)
The workhorse MEMS substrate. Available in all diameters (100–300mm), orientations, and doping levels. Standard CZ for most applications; FZ for high-resistivity RF-MEMS. DRIE-compatible with established Bosch process recipes.
SOI (Silicon-On-Insulator)
Device silicon layer over buried oxide. Enables precise etch stops, vertical isolation for capacitive sensors, and superior mechanical properties. The preferred substrate for high-performance inertial sensors and optical MEMS.
Glass (Borosilicate / Fused Silica)
Transparent substrate for optical MEMS and bio-MEMS. Anodic bonding to silicon for hermetic cavity sealing. Low-autofluorescence grades for fluorescence-based biosensors. CTE-matched borosilicate for stress-free silicon-glass stacks.
Piezoelectric Materials (AlN, PZT, ZnO)
Thin-film piezoelectric layers deposited on silicon for acoustic (BAW/SAW filters), ultrasonic (pMUTs for fingerprint and medical imaging), and energy harvesting MEMS devices. AlN preferred for CMOS compatibility.
MEMS Process Services
Full range of MEMS-grade silicon and SOI wafers with custom resistivity, device layer thickness, and BOX specifications. Double-side polished (DSP) for bulk micromachining processes.
AlN and PZT sputtering on silicon wafers for acoustic resonator and ultrasonic transducer fabrication. Optimized film stress and crystallographic texture (c-axis orientation) for maximum piezoelectric coupling.
High-aspect-ratio silicon etching via Bosch process for MEMS structures. Aspect ratios > 30:1, vertical sidewall profiles, and controlled scalloping. Compatible with SOI device layer release.
Anodic (Si-glass), fusion (Si-Si), and eutectic (Au-Si, AuSn) bonding for MEMS encapsulation and 3D stacking. Wafer-level hermetic sealing for vacuum-packaged resonators and pressure sensors.
HF vapor and wet-chemical release of MEMS structures via sacrificial SiO₂ or poly-Si etching. Critical-point drying (CPD) for stiction-free release of suspended microstructures.
PVD sputtering of Au, Pt, Al, Ti, Cr electrodes and interconnect traces. Lift-off patterning for MEMS-specific electrode geometries. Biocompatible metallization for implantable devices.
MEMS Design Considerations
Successful MEMS fabrication demands careful attention to several substrate and process parameters beyond standard CMOS requirements: wafer thickness control (for resonant frequency accuracy in inertial sensors), crystallographic orientation (〈100〉 for bulk micromachining, 〈111〉 for anisotropic KOH etching as an etch stop), resistivity (high-resistivity Si > 1,000 Ω·cm for reduced RF substrate losses), and SOI device layer uniformity (±0.5μm or better for capacitive gap control).
Our engineering team can guide you through substrate selection for your specific MEMS design, process integration sequence, and packaging approach — ensuring material compatibility and process margin across your full fabrication flow.
Packaging & Hermetic Sealing
MEMS devices — unlike standard ICs — contain mechanically moving elements or exposed sensing surfaces that require specialized packaging: wafer-level packaging (WLP) with anodic or eutectic bonding for hermetic cavity sealing, through-silicon vias (TSVs) for vertical electrical feedthrough, getter integration for long-term vacuum maintenance in resonant devices, and optical windows (glass or sapphire caps) for optical MEMS and image sensors. We offer wafer bonding services and substrate solutions for each packaging architecture.
Quality & Reliability
MEMS sensor reliability demands are stringent — automotive qualification (AEC-Q100) requires 1,000+ hours of high-temperature operating life (HTOL) testing with zero field failures over 15-year lifecycles. Our substrates and processes support these requirements with: tight thickness and resistivity specifications, low particle counts for high yield, and full SEMI standard compliance with lot traceability and Certificate of Conformance.
Building MEMS Sensors?
Share your MEMS design requirements and process flow — our engineering team will recommend the optimal substrate and provide a complete quotation for materials and process services within 24 hours.