Exhibition & Events — Semiconductor Trade Shows & Conferences | GINECHIP

Stat Value 1Technology

Stat Value 2Resolution

Stat Value 3Capacity

Stat Value 4Certification

Overview

A comprehensive overview of our capabilities and services.

We deliver industry-leading quality and precision.

H 2Schedule

exhibitionEvents.ex1Name

Label Date2025 年 10 月 7–9 日 · Label Location舊金山 Moscone Center, California, USA

exhibitionEvents.ex1Focus

Label ParticipationexhibitionEvents.ex1Booth

30,000+ 參觀者500+ 參展商AI 晶片製造先進封裝SiC/GaN 量產永續發展

exhibitionEvents.ex2Name

Label Date2026 年 3 月 18–20 日 · Label Location上海新國際博覽中心 (SNIEC), 中國

exhibitionEvents.ex2Focus

Label ParticipationexhibitionEvents.ex2Booth

100,000+ 訪客1,100+ 展商國產化設備第三代半導體成熟製程擴張全產業鏈

exhibitionEvents.ex3Name

Label Date2025 年 11 月 11–14 日 · Label LocationMesse München, Munich, Germany

exhibitionEvents.ex3Focus

Label ParticipationexhibitionEvents.ex3Booth

歐洲旗艦展會車用電子工業功率MEMS 傳感器歐盟 Chips Act與 productronica 同期

exhibitionEvents.ex4Name

Label Date2025 年 12 月 10–12 日 · Label Location東京國際展示場 (Tokyo Big Sight), 日本

exhibitionEvents.ex4Focus

Label ParticipationexhibitionEvents.ex4Booth

日本旗艦展會Rapidus 2nm晶圓材料先進封裝材料政府補貼供應鏈重組

exhibitionEvents.ex5Name

Label Date2025 年 10 月 20–22 日 · Label LocationSan Diego, California, USA

exhibitionEvents.ex5Focus

Label ParticipationexhibitionEvents.ex5Booth

MEMS 高階會議代工廠齊聚MEMS 揚聲器LiDAR 微鏡AI 傳感器融合供應鏈網絡

exhibitionEvents.ex6Name

Label Date2026 年 2 月 15–19 日 · Label LocationSan Francisco Marriott Marquis, California, USA

exhibitionEvents.ex6Focus

Label ParticipationexhibitionEvents.ex6Booth

IC 設計頂會GAA/CFET 實現3D 堆疊Chiplet 互連AI 加速器學術/產業橋樑

exhibitionEvents.ex7Name

Label Date2025 年 12 月 6–10 日 · Label LocationSan Francisco, California, USA

exhibitionEvents.ex7Focus

Label ParticipationexhibitionEvents.ex7Booth

元件物理頂會CMOS 縮放新興記憶體功率半導體MEMS 物理量子元件

exhibitionEvents.ex8Name

Label Date2026 年 5 月 26–29 日 · Label LocationOrlando, Florida, USA

exhibitionEvents.ex8Focus

Label ParticipationexhibitionEvents.ex8Booth

封裝旗艦會議CoWoS/EMIB/Foveros混合鍵合 Cu-Cu中介層技術超薄晶圓異質整合

H 2Meet

exhibitionEvents.meet1Title

exhibitionEvents.meet1Desc

exhibitionEvents.meet2Title

exhibitionEvents.meet2Desc

exhibitionEvents.meet3Title

exhibitionEvents.meet3Desc

exhibitionEvents.meet4Title

exhibitionEvents.meet4Desc

H 2Past

exhibitionEvents.past1Event

exhibitionEvents.past1Highlight

exhibitionEvents.past2Event

exhibitionEvents.past2Highlight

exhibitionEvents.past3Event

exhibitionEvents.past3Highlight

H 2Booking

Schedule a private meeting with our technical team at upcoming exhibitions. We will prepare customized wafer samples, process capability presentations, and preliminary quotations specific to your application before the event.

Can't attend in person? Request a virtual meeting or schedule a visit to our facility. We also offer on-site technical seminars at your location for teams of 5 or more engineers.

CTA Title

Contact our engineering team to discuss your specific requirements and receive a detailed quotation within 24 hours.

Request a Quote Contact Engineers

Meta 1 Meta 2 Meta 3 Meta 4